The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2019

Filed:

Aug. 20, 2015
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

William Thomas Carter, Galway, NY (US);

Todd Jay Rockstroh, Maineville, OH (US);

Douglas Gerard Konitzer, West Chester, OH (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22F 1/10 (2006.01); B23K 26/03 (2006.01); B23K 26/342 (2014.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 80/00 (2015.01); B23K 26/144 (2014.01); B23K 26/70 (2014.01); B23K 26/00 (2014.01); B23K 26/14 (2014.01); B22F 3/105 (2006.01); B22F 5/04 (2006.01); B33Y 50/02 (2015.01); B23K 101/00 (2006.01); B23K 103/08 (2006.01); F01D 5/18 (2006.01); F01D 5/28 (2006.01); F01D 9/02 (2006.01);
U.S. Cl.
CPC ...
C22F 1/10 (2013.01); B22F 3/1055 (2013.01); B22F 5/04 (2013.01); B23K 26/0006 (2013.01); B23K 26/034 (2013.01); B23K 26/144 (2015.10); B23K 26/1464 (2013.01); B23K 26/342 (2015.10); B23K 26/703 (2015.10); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B33Y 80/00 (2014.12); B22F 2003/1057 (2013.01); B22F 2999/00 (2013.01); B23K 2101/001 (2018.08); B23K 2103/08 (2018.08); F01D 5/18 (2013.01); F01D 5/28 (2013.01); F01D 9/02 (2013.01); F05D 2220/32 (2013.01); F05D 2230/30 (2013.01); F05D 2260/20 (2013.01); F05D 2300/175 (2013.01); Y02P 10/295 (2015.11);
Abstract

Methods for direct writing of single crystal super alloys and metals are provided. The method can include: heating a substrate positioned on a base plate to a predetermined temperature using a first heater; using a laser to form a melt pool on a surface of the substrate; introducing a superalloy powder to the melt pool; measuring the temperature of the melt pool; receiving the temperature measured at a controller; and using an auxiliary heat source in communication with the controller to adjust the temperature of the melt pool. The predetermined temperature is below the substrate's melting point. The laser and the base plate are movable relative to each other, with the laser being used for direct metal deposition. An apparatus is also generally provided for direct writing of single crystal super alloys and metals.


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