The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2019

Filed:

Jan. 29, 2015
Applicant:

Dexerials Corporation, Tokyo, JP;

Inventors:

Yuta Araki, Tochigi, JP;

Tomoyuki Ishimatsu, Utsunomiya, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 7/10 (2018.01); C09J 9/02 (2006.01); B32B 27/20 (2006.01); B32B 27/08 (2006.01); H01L 23/00 (2006.01); C09J 7/00 (2018.01); C09J 11/02 (2006.01); B32B 27/06 (2006.01); B32B 27/18 (2006.01); C08K 7/00 (2006.01);
U.S. Cl.
CPC ...
C09J 7/00 (2013.01); B32B 27/06 (2013.01); B32B 27/08 (2013.01); B32B 27/18 (2013.01); B32B 27/20 (2013.01); C09J 7/10 (2018.01); C09J 9/02 (2013.01); C09J 11/02 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); B32B 2307/20 (2013.01); B32B 2307/202 (2013.01); B32B 2307/206 (2013.01); B32B 2307/706 (2013.01); B32B 2457/00 (2013.01); B32B 2457/14 (2013.01); C08K 7/00 (2013.01); C08K 2201/001 (2013.01); C09J 2201/134 (2013.01); C09J 2201/36 (2013.01); C09J 2201/602 (2013.01); C09J 2203/326 (2013.01); C09J 2205/102 (2013.01); C09J 2433/00 (2013.01); C09J 2463/00 (2013.01); C09J 2471/00 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/2612 (2013.01); H01L 2224/271 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/27334 (2013.01); H01L 2224/294 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29082 (2013.01); H01L 2224/29083 (2013.01); H01L 2224/29295 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29357 (2013.01); H01L 2224/29364 (2013.01); H01L 2224/29387 (2013.01); H01L 2224/29455 (2013.01); H01L 2224/29464 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81488 (2013.01); H01L 2224/81903 (2013.01); H01L 2224/83007 (2013.01); H01L 2224/83138 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83488 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/83871 (2013.01); H01L 2924/07 (2013.01); H01L 2924/3511 (2013.01);
Abstract

An anisotropic conductive film contains conductive particles and spacers. The spacers are arranged at a central part of the film in a width direction. The central part of the film in the width direction represents 20 to 80% of the overall width of the film. The height of the spacers in the thickness direction of the anisotropic conductive film is larger than 5 μm and less than 75 μm. Such an anisotropic conductive film has a layered structure having a first insulating adhesion layer and a second insulating adhesion layer, wherein the conductive particles are dispersed in the first insulating adhesion layer, and the spacers are regularly arranged on a surface of the first insulating adhesion layer on a side of the second insulating adhesion layer.


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