The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2019

Filed:

Aug. 12, 2014
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Peter D. Condo, Lake Elmo, MN (US);

Jeremy O. Swanson, Woodbury, MN (US);

James E. Thorson, Hudson, WI (US);

Kristin L. Thunhorst, Stillwater, MN (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 9/04 (2006.01); C09D 7/40 (2018.01); C08J 5/24 (2006.01); C08K 9/06 (2006.01); C08J 5/00 (2006.01); C08K 7/00 (2006.01); C08K 7/18 (2006.01); C08K 7/28 (2006.01); C08L 63/00 (2006.01); C08K 3/36 (2006.01); C09D 7/20 (2018.01);
U.S. Cl.
CPC ...
C08K 9/04 (2013.01); C08J 5/005 (2013.01); C08J 5/24 (2013.01); C08K 3/36 (2013.01); C08K 7/00 (2013.01); C08K 7/18 (2013.01); C08K 7/28 (2013.01); C08K 9/06 (2013.01); C08L 63/00 (2013.01); C09D 7/20 (2018.01); C09D 7/40 (2018.01); B05D 2601/02 (2013.01); B05D 2601/22 (2013.01); C08J 2333/08 (2013.01); C08J 2333/24 (2013.01); C08J 2363/00 (2013.01); C08K 2201/003 (2013.01); C08K 2201/011 (2013.01);
Abstract

A nanocomposite is provided including silica nanoparticles and a dispersant dispersed in a curable resin or a curing agent, where the nanocomposite contains less than 2% by weight solvent. The silica nanoparticles include nonspherical silica nanoparticles and/or spherical pyrogenic silica nanoparticles. A composite is also provided including from about 4 to 70 weight percent of silica nanoparticles, and a dispersant, dispersed in a cured resin, and a filler embedded in the cured resin. Optionally, the composite further contains a curing agent. Further, a method of preparing a nanoparticle-containing curable resin system is provided including mixing from 10 to 70 weight percent of aggregated silica nanoparticles with a curable resin and a dispersant to form a mixture. The mixture contains less than 2% by weight solvent. The method also includes milling the mixture in an immersion mill containing milling media to form a milled resin system including silica nanoparticles dispersed in the curable resin.


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