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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10442739 B1

PDFFull Text
Date of Patent:
Oct. 15, 2019

Filed:

Jul. 28, 2016

Porous plate-shaped filler

Applicant:

Ngk Insulators, Ltd., Nagoya, JP;

Inventor:

Hiroharu Kobayashi, Nagoya, JP;

Assignee:

NGK Insulators, Ltd., Nagoya, JP;

Attorney:

Burr & Brown, PLLC

Primary Examiner:

Z Jim Yang

Int. Cl.
CPC ...
C04B 38/00 (2006.01); C08K 7/24 (2006.01); F02F 1/42 (2006.01); C04B 35/488 (2006.01); C04B 35/622 (2006.01); C04B 35/626 (2006.01); C04B 35/638 (2006.01); C04B 35/48 (2006.01); C04B 35/634 (2006.01); C04B 38/06 (2006.01); C09K 21/02 (2006.01); F01N 13/08 (2010.01); F01N 13/14 (2010.01); C04B 111/00 (2006.01); C04B 111/28 (2006.01);
U.S. Cl.
CPC ...
C04B 38/009 (2013.01); C04B 35/48 (2013.01); C04B 35/488 (2013.01); C04B 35/622 (2013.01); C04B 35/6264 (2013.01); C04B 35/62625 (2013.01); C04B 35/638 (2013.01); C04B 35/6342 (2013.01); C04B 38/068 (2013.01); C08K 7/24 (2013.01); C09K 21/02 (2013.01); F01N 13/08 (2013.01); F01N 13/14 (2013.01); F02F 1/4264 (2013.01); C01P 2006/14 (2013.01); C01P 2006/17 (2013.01); C04B 2111/00405 (2013.01); C04B 2111/28 (2013.01); C04B 2235/3244 (2013.01); C04B 2235/60 (2013.01); C04B 2235/6025 (2013.01); C04B 2235/656 (2013.01); C04B 2235/6567 (2013.01); C04B 2235/661 (2013.01); C04B 2235/775 (2013.01); C04B 2235/9607 (2013.01); C04B 2237/341 (2013.01); C04B 2237/348 (2013.01); C04B 2237/58 (2013.01); C08K 2201/004 (2013.01); C08K 2201/016 (2013.01); F05C 2251/048 (2013.01); F05C 2253/12 (2013.01); Y10T 428/2982 (2015.01); Y10T 428/2991 (2015.01);
Abstract

Provided is a porous plate-shaped filler that can be used as a material for a heat-insulation film having excellent heat insulation performance. In a porous plate-shaped fillerhaving a plate shape, an aspect ratio is 3 or higher, a minimum length is 0.5 to 50 μm, and an overall porosity is 20 to 90%, and the porosity is lower in the circumferential part than in the center part. When this porous plate-shaped fillerof the present invention is contained in a heat-insulation film, the infiltration of a matrix into the filler is reduced, and thus the thermal conductivity can be lowered. Therefore, even a thin heat-insulation film can have a greater heat-insulation effect than before.

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