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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10442724 B1

PDFFull Text
Date of Patent:
Oct. 15, 2019

Filed:

Jul. 11, 2016

Joining material and joined body using same

Applicant:

Hitachi, Ltd., Tokyo, JP;

Inventors:

Takuya Aoyagi, Tokyo, JP;

Takashi Naito, Tokyo, JP;

Tatsuya Miyake, Tokyo, JP;

Assignee:

HITACHI LTD., Tokyo, JP;

Attorney:

Volpe and Koenig, P.C.

Primary Examiner:

David Sample

Assistant Examiner:

Donald M Flores, Jr

Int. Cl.
CPC ...
C03C 8/24 (2006.01); B32B 7/02 (2019.01); B32B 7/12 (2006.01); C03C 3/12 (2006.01); C03C 3/14 (2006.01); C03C 3/21 (2006.01); C03C 8/02 (2006.01); C03C 8/04 (2006.01); C03C 8/08 (2006.01); B23K 35/36 (2006.01);
U.S. Cl.
CPC ...
C03C 8/24 (2013.01); B32B 7/02 (2013.01); B32B 7/12 (2013.01); C03C 3/122 (2013.01); C03C 3/14 (2013.01); C03C 3/21 (2013.01); C03C 8/02 (2013.01); C03C 8/04 (2013.01); C03C 8/08 (2013.01); B23K 35/3601 (2013.01); B23K 35/3613 (2013.01); B32B 2250/03 (2013.01); B32B 2264/0214 (2013.01); B32B 2264/105 (2013.01); B32B 2264/107 (2013.01); B32B 2307/30 (2013.01); B32B 2405/00 (2013.01);
Abstract

The purpose of the present invention is to provide a joining material that can easily join materials to be joined even when characteristics and physical properties thereof differ greatly. To solve the above problem, the joining material according to the present invention is characterized by including a base material, a first layer that is disposed on one surface of the base material, and a second layer that is disposed on the other surface of the base material and includes a phase having a different coefficient of thermal expansion to that of the phase configuring the first layer, at least one of the first and second layers including glass having a softening point of 600° C. or lower.

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