The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2019
Filed:
Feb. 24, 2015
Applicant:
Iowa State University Research Foundation, Inc., Ames, IA (US);
Inventors:
Iver E. Anderson, Ames, IA (US);
Joel L. Harringa, Ames, IA (US);
Adam J. Boesenberg, Ankeny, IA (US);
Assignee:
Iowa State University Research Foundation, Inc., Ames, IA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); C22C 13/00 (2006.01); B23K 35/00 (2006.01); B23K 35/02 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B23K 35/001 (2013.01); B23K 35/0244 (2013.01); C22C 13/00 (2013.01); H05K 3/3463 (2013.01);
Abstract
A solder alloy includes Sn, optional Ag, Cu, and Al wherein the alloy composition is controlled to provide a strong, impact-and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of AgSn blades.
Anderson, Iver. (2019). Pb-free sn—ag—cu—al or sn—cu—al solder (U.S. Patent No. 10442037). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10442037
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile