The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2019

Filed:

Jun. 16, 2017
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Ryohei Hayashi, Tokyo, JP;

Goki Furuya, Tokyo, JP;

Kohei Ando, Tokyo, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H02M 7/00 (2006.01); H02M 7/48 (2007.01);
U.S. Cl.
CPC ...
H05K 7/20927 (2013.01); H02M 7/003 (2013.01); H02M 7/48 (2013.01); H05K 7/209 (2013.01); H05K 7/2089 (2013.01); H05K 7/20218 (2013.01); H05K 7/20254 (2013.01); H05K 7/20272 (2013.01); H05K 7/20281 (2013.01); H05K 7/20409 (2013.01); H05K 7/20509 (2013.01); H05K 7/20627 (2013.01); H05K 7/20763 (2013.01); H05K 7/20845 (2013.01); H05K 7/20854 (2013.01); H05K 7/20863 (2013.01); H05K 7/20872 (2013.01); H05K 7/20909 (2013.01); H05K 7/20945 (2013.01);
Abstract

A power conversion device such that heat dissipation can be improved is obtained. The power conversion device includes a power conversion circuit unit that converts direct current into alternating current using a semiconductor switching element, a heatsink on which the power conversion circuit unit is mounted, and which has a first passage through which a cooling medium is caused to pass, and a frame body that houses the power conversion circuit unit, seals the power conversion circuit unit between the frame body and the heatsink, and has a second passage through which a cooling medium is caused to pass, wherein the first passage and second passage are connected at an interface between the heatsink and frame body, thereby configuring a cooling passage.


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