The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2019
Filed:
Nov. 15, 2016
Applicant:
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Inventors:
Hirohisa Hino, Osaka, JP;
Naomichi Ohashi, Hyogo, JP;
Yuki Yoshioka, Osaka, JP;
Masato Mori, Hyogo, JP;
Yasuhiro Suzuki, Osaka, JP;
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
C09J 163/00 (2006.01); C09J 9/02 (2006.01); C09J 11/02 (2006.01); C09J 11/04 (2006.01); C09J 11/06 (2006.01); C08K 3/10 (2018.01); C08K 3/36 (2006.01); C08K 9/04 (2006.01); H05K 3/34 (2006.01); H01L 23/00 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); B23K 35/24 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3489 (2013.01); B23K 35/24 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H05K 1/11 (2013.01); H05K 1/18 (2013.01); H05K 3/34 (2013.01); H05K 3/3457 (2013.01); H05K 3/3463 (2013.01); H01L 23/49883 (2013.01); H01L 2224/133 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/1329 (2013.01); H01L 2224/1349 (2013.01); H01L 2224/13294 (2013.01); H01L 2224/13311 (2013.01); H01L 2224/13313 (2013.01); H01L 2224/13387 (2013.01); H01L 2224/13499 (2013.01); H01L 2224/1601 (2013.01); H01L 2224/16013 (2013.01); H01L 2224/16058 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16505 (2013.01); H01L 2224/8121 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/81862 (2013.01); H01L 2224/81905 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H05K 3/3436 (2013.01); H05K 3/3484 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0227 (2013.01);
Abstract
Provided herein is a resin fluxed solder paste that exhibits a desirable solder bump reinforcement effect without requiring an underfill process. The disclosure also provides a mount structure. The resin fluxed solder paste includes a non-resinic powder containing a solder powder and an inorganic powder; and a flux containing a first epoxy resin, a curing agent, and an organic acid. The non-resinic powder accounts for 30 to 90 wt % of the total, and the surface of the inorganic powder is covered with an organic resin.