The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2019

Filed:

Dec. 16, 2016
Applicant:

Yazaki Corporation, Tokyo, JP;

Inventors:

Takafumi Toda, Kosai, JP;

Takeyuki Hamaguchi, Kosai, JP;

Assignee:

Yazaki Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/20 (2006.01); H05K 1/02 (2006.01); H05K 13/04 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/20 (2013.01); H05K 1/0203 (2013.01); H05K 1/0209 (2013.01); H05K 1/0212 (2013.01); H05K 1/0263 (2013.01); H05K 3/0044 (2013.01); H05K 13/04 (2013.01); H05K 3/202 (2013.01); H05K 2201/09781 (2013.01); H05K 2201/10272 (2013.01); H05K 2203/0228 (2013.01); Y10T 29/4913 (2015.01);
Abstract

An electronic component board is produced by die-cutting a metal plate in a lump into the bus bars and a band-shaped connecting portion connected to the bus bars, having a constant width, and positioned at an outer edge of the metal plate, by attaching the bus bars to the insulating plate, and by cutting and removing the connecting portion while leaving a part of the connecting portion uncut which is used as the heat radiating portion. Additional steps of the method include providing the metal plate, the insulation plate, and an electrical component, and electrically connecting the electrical component to the plurality of bus bars.


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