The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2019

Filed:

Dec. 16, 2014
Applicant:

Ems-patent Ag, Domat/Ems, CH;

Inventor:

Georg Stoeppelmann, Bonaduz, CH;

Assignee:

EMS-PATENT AG, Domat/Ems, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/18 (2006.01); C08K 3/22 (2006.01); C08K 3/24 (2006.01); C08K 7/14 (2006.01); C08L 77/00 (2006.01); H05K 3/00 (2006.01); C08L 77/04 (2006.01); C08L 77/06 (2006.01); H05K 3/20 (2006.01);
U.S. Cl.
CPC ...
H05K 3/185 (2013.01); C08K 3/22 (2013.01); C08K 3/24 (2013.01); C08K 7/14 (2013.01); C08L 77/00 (2013.01); C08L 77/04 (2013.01); C08L 77/06 (2013.01); H05K 3/0014 (2013.01); H05K 3/202 (2013.01); C08K 2003/2248 (2013.01); C08K 2003/2251 (2013.01); H05K 2201/0129 (2013.01); H05K 2203/107 (2013.01);
Abstract

A method for producing a laser-structurable component, wherein an extruded single- or multilayer molded part with at least one laser-structurable layer that forms an exposed surface of the molded part is applied onto the surface of a non-laser-structurable support element. Alternatively, the at least one laser-structurable layer may be back-molded with a non-laser-structurable thermoplastic support element so that at least one laser-structurable layer of the molded part forms at least one part of the surface of the laser-structurable component. The extruded single- or multilayer molded part is deep-drawn into the component. In the process, the laser-structurable layer of the molded part consists of a thermoplastic molding compound consisting of: (A) 30-99.9 wt. % of a thermoplastic consisting of polyamide; (B) 0.1-10 wt. % of an LDS additive; and (C) 0-60 wt. % of an additive material which is different from (A) and (B).


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