The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2019

Filed:

Jul. 02, 2015
Applicants:

United Technologies Corporation, Hartford, CT (US);

Goodrich Corporation, Uniontown, OH (US);

Inventors:

Sameh Dardona, South Windsor, CT (US);

Michael P. Humbert, Manchester, CT (US);

John P. Wesson, West Hartford, CT (US);

Wayde R. Schmidt, Pomfret Center, CT (US);

Daniel V. Viens, Mansfield Center, CT (US);

Jin Hu, Hudson, OH (US);

Assignee:

United Technologies Corporation, Farmington, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05B 3/12 (2006.01); H05B 3/14 (2006.01); H05B 3/26 (2006.01); H05B 3/34 (2006.01); H05B 3/84 (2006.01); H05B 3/00 (2006.01); H05B 3/06 (2006.01); H05B 3/16 (2006.01); H05K 3/12 (2006.01); H05K 3/30 (2006.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
H05K 3/0014 (2013.01); H05B 3/0014 (2013.01); H05B 3/06 (2013.01); H05B 3/12 (2013.01); H05B 3/145 (2013.01); H05B 3/16 (2013.01); H05B 3/265 (2013.01); H05B 3/267 (2013.01); H05B 3/34 (2013.01); H05B 3/84 (2013.01); H05K 3/12 (2013.01); H05K 3/30 (2013.01); B33Y 80/00 (2014.12); H05B 2203/003 (2013.01); H05B 2203/013 (2013.01); H05B 2203/017 (2013.01); H05B 2214/02 (2013.01); H05B 2214/04 (2013.01);
Abstract

A heating circuit assembly and method of manufacture includes an electrically conductive heating element having a pattern. An electrically non-conductive substrate is additive manufactured and secured to the element for structural support. The substrate has a topology that generally aligns with the pattern of the element thereby reducing the assembly weight and minimizing substrate material waste.


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