The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2019
Filed:
Jun. 13, 2017
Applicant:
Infineon Technologies Austria Ag, Villach, AT;
Inventors:
Frank Pueschner, Kelheim, DE;
Peter Stampka, Burglengenfeld, DE;
Jens Pohl, Bernhardswald, DE;
Marcus Janke, Munich, DE;
Assignee:
Infineon Technologies Austria AG, Villach, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/077 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/40 (2006.01); H01R 12/71 (2011.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); G06K 19/07722 (2013.01); G06K 19/07733 (2013.01); G06K 19/07737 (2013.01); G06K 19/07739 (2013.01); G06K 19/07741 (2013.01); G06K 19/07747 (2013.01); G06K 19/07766 (2013.01); G06K 19/07773 (2013.01); H01R 12/714 (2013.01); H05K 1/11 (2013.01); H05K 1/113 (2013.01); H05K 3/4007 (2013.01); H05K 1/0275 (2013.01); H05K 3/4608 (2013.01); H05K 3/4694 (2013.01); H05K 2201/086 (2013.01); H05K 2201/09409 (2013.01); H05K 2201/09445 (2013.01); H05K 2201/09663 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10719 (2013.01);
Abstract
In various embodiments, a chip card module is provided. The chip card module includes a chip card module contact array having six contact pads that are arranged in two rows having three contact pads each in accordance with ISO 7816, and three additional contact pads that are arranged between the two rows. Each additional contact pad is electrically conductively connected to a respective associated contact pad from a row from the two rows.