The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2019

Filed:

Oct. 08, 2018
Applicant:

Alpha Networks Inc., Hsinchu, TW;

Inventor:

Rong- Fa Kuo, Hsinchu, TW;

Assignee:

ALPHA NETWORKS INC., Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 7/38 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0251 (2013.01); H03H 7/38 (2013.01); H05K 1/115 (2013.01); H05K 1/16 (2013.01); H05K 1/0222 (2013.01); H05K 1/0298 (2013.01); H05K 3/429 (2013.01); H05K 2201/09236 (2013.01);
Abstract

An impedance matching structure is disposed on a multilayer circuit board for matching an impedance of a transmission line for transmitting an electronic signal. At least one redundant conducting section is coupled to a conductive member of the transmission line between input and output terminals of the transmission line. The conductive member and the redundant conducting section are disposed in a corresponding plating hole. At least one grounding member disposed adjacent to but separated from either or both of the conductive member of the transmission line and the at least one redundant conducting section in a capacitor structure for impedance matching. The at least one grounding member includes a first grounding member penetrating through at least two layers of the multilayer circuit board.


Find Patent Forward Citations

Loading…