The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2019

Filed:

Dec. 29, 2017
Applicants:

Hisense Broadband Multimedia Technologies Co., Ltd., Qingdao, Shandong, CN;

Hisense Broadband Multimedia Technologies, Ltd., Tortola, VG;

Inventor:

Long Zheng, Shandong, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04B 10/00 (2013.01); H05B 37/02 (2006.01); F21V 29/504 (2015.01); F21V 29/508 (2015.01); F21V 29/83 (2015.01); F21V 5/04 (2006.01); F21V 23/00 (2015.01); G02B 6/42 (2006.01); H04B 10/40 (2013.01); H04B 10/50 (2013.01); H04B 10/85 (2013.01); H04B 15/02 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H05B 37/0209 (2013.01); F21V 5/04 (2013.01); F21V 23/005 (2013.01); F21V 29/504 (2015.01); F21V 29/508 (2015.01); F21V 29/83 (2015.01); G02B 6/4206 (2013.01); G02B 6/428 (2013.01); G02B 6/4214 (2013.01); G02B 6/4246 (2013.01); G02B 6/4251 (2013.01); G02B 6/4256 (2013.01); G02B 6/4274 (2013.01); G02B 6/4283 (2013.01); G02B 6/4292 (2013.01); H04B 10/40 (2013.01); H04B 10/503 (2013.01); H04B 10/85 (2013.01); H04B 15/02 (2013.01); H05K 9/0058 (2013.01);
Abstract

The present disclosure discloses an optical module, and relates to the field of optical fiber communication technologies. A first sealing piece is configured to block the gap between the optical fiber ribbon and the blocking piece. For the optical module and an optical communication terminal provided in the present application, an electromagnetic wave generated by the optical module is directly radiated or is reflected several times until the electromagnetic wave enters a wave-absorbing pad. The wave-absorbing pad absorbs to the greatest extent an electromagnetic wave generated by a chip, and can reduce to the greatest extent electromagnetic interference (EMI) generated by the optical module. By means of the present disclosure, the sealing performance of a housing of the optical module can be improved, so that an EMI shielding effect is improved, thereby effectively reducing EMI.


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