The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2019

Filed:

Jul. 27, 2017
Applicant:

GM Global Technology Operations Llc, Detroit, MI (US);

Inventors:

Ronald W. Young, Clarkston, MI (US);

Terence G. Ward, Waterford, MI (US);

Marko Jaksic, Shelby Township, MI (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B60L 11/18 (2006.01); H02P 27/06 (2006.01); H02M 7/00 (2006.01); B60L 50/51 (2019.01); H02M 7/539 (2006.01); H02M 7/5387 (2007.01); H02P 101/45 (2016.01);
U.S. Cl.
CPC ...
H02M 7/003 (2013.01); B60L 50/51 (2019.02); H02M 7/539 (2013.01); H02M 7/53875 (2013.01); H02P 27/06 (2013.01); B60L 2210/40 (2013.01); H02P 2101/45 (2015.01);
Abstract

A power module includes a first circuit structure having a first bus substrate. The first bus structure has a first side on which is disposed a first circuit element. A second circuit structure has a second bus substrate and a second side on which is disposed a second circuit element. The first circuit structure and the second circuit structure are oriented in a stacked configuration such that the first side is disposed facing the second side, and the first circuit element partially overlaps the second circuit element. An output bus is disposed between the first circuit structure and the second circuit structure.


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