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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10439379 B1

PDFFull Text
Date of Patent:
Oct. 08, 2019

Filed:

Jun. 07, 2017

Substrate unit

Applicants:

Autonetworks Technologies, Ltd., Yokkaichi, Mie, JP;

Sumitomo Wiring Systems, Ltd., Yokkaichi, Mie, JP;

Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;

Inventors:

Hideaki Tahara, Mie, JP;

Arinobu Nakamura, Mie, JP;

Kazuyoshi Ohara, Mie, JP;

Munsoku O, Mie, JP;

Assignees:

AutoNetworks Technologies, Ltd., Yokkaichi, Mie, JP;

Sumitomo Wiring Systems, Ltd., Yokkaichi, Mie, JP;

Sumitomo Electric Industries, Ltd., Osaka-Shi, Osaka, JP;

Attorney:

Honigman LLP

Primary Examiner:

Angel R Estrada

Int. Cl.
CPC ...
H02G 3/16 (2006.01); H05K 7/06 (2006.01); H01R 25/16 (2006.01); H05K 5/02 (2006.01); B60R 16/023 (2006.01); H05K 1/00 (2006.01); H05K 5/00 (2006.01); H01R 12/71 (2011.01); H01R 12/70 (2011.01); H01R 12/72 (2011.01); H02G 3/08 (2006.01);
U.S. Cl.
CPC ...
H02G 3/16 (2013.01); B60R 16/0239 (2013.01); H01R 25/16 (2013.01); H05K 1/00 (2013.01); H05K 5/0043 (2013.01); H05K 5/02 (2013.01); H05K 7/06 (2013.01); H01R 12/7047 (2013.01); H01R 12/71 (2013.01); H01R 12/724 (2013.01); H02G 3/086 (2013.01);
Abstract

A substrate unit includes a circuit board, a connector portion installed at the front end portion of the upper side of the circuit board, a busbar connected to the circuit board and fixed to the lower side of the circuit board, a bottom portion including a recessed portion overlapping the front end portion of the circuit board and arranged on the lower side of the busbar, and a bonding layer fixing the busbar to the bottom portion. The busbar includes a non-bonding region that faces the recessed portion. A bonding region includes the bonding layer surrounding three sides other than a front side, namely a left side, a right side, and a rear side, of the non-bonding region. Notches are located on a left side and a right side of the front end portion and overlap extension lines of boundary between the non-bonding and the bonding region.

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