The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2019

Filed:

Jan. 31, 2018
Applicant:

The Johns Hopkins University, Baltimore, MD (US);

Inventors:

Kenneth R. Grossman, Olney, MD (US);

Joseph A. Miragliotta, Ellicott City, MD (US);

Adam J. Maisano, Sykesville, MD (US);

Douglas B. Trigg, Elkton, MD (US);

Assignee:

The Johns Hopkins University, Baltimore, MD (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 7/24 (2006.01); H01Q 15/00 (2006.01); H01Q 17/00 (2006.01); H01Q 1/52 (2006.01); H01R 4/48 (2006.01);
U.S. Cl.
CPC ...
H01Q 15/008 (2013.01); H01Q 1/52 (2013.01); H01Q 17/007 (2013.01); H01Q 17/008 (2013.01); H01R 4/48 (2013.01); H03H 7/24 (2013.01);
Abstract

A radio frequency surface wave attenuator structure is provided. The structure may be configured to be operably coupled with a plurality of other radio frequency surface wave attenuator structures to form a metamaterial. The radio frequency surface wave attenuator structure may include a patch disposed in a first plane and defining a patch area and a backplane disposed in a second plane and extending along the second plane to be shared with the other surface wave attenuator structures. The structure may further include a via spring having a number of turns and being comprised of a conductive material. The via spring may electrically couple the patch to the backplane. The structure may further include a dielectric disposed between the patch and the backplane.


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