The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2019
Filed:
Jun. 12, 2015
Applicant:
Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;
Inventors:
Takahiro Fukuoka, Ibaraki, JP;
Kyoko Ishii, Ibaraki, JP;
Shunsuke Masaki, Ibaraki, JP;
Kenta Hata, Ibaraki, JP;
Hiroshi Yukawa, Nagoya, JP;
Tomonori Nanbu, Suzuka, JP;
Assignee:
NITTO DENKO CORPORATION, Ibaraki-shi, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 2/12 (2006.01); B01D 69/10 (2006.01); B01D 69/12 (2006.01); B01D 71/02 (2006.01); B01D 71/36 (2006.01); B01D 71/38 (2006.01); H01G 9/12 (2006.01); H01G 11/14 (2013.01); H01G 9/045 (2006.01); H01M 10/0525 (2010.01); C22C 5/04 (2006.01);
U.S. Cl.
CPC ...
H01M 2/1264 (2013.01); B01D 69/10 (2013.01); B01D 69/12 (2013.01); B01D 71/02 (2013.01); B01D 71/36 (2013.01); B01D 71/38 (2013.01); H01G 9/045 (2013.01); H01G 9/12 (2013.01); H01G 11/14 (2013.01); H01M 2/12 (2013.01); H01M 2/1241 (2013.01); H01M 10/0525 (2013.01); C22C 5/04 (2013.01); H01M 2200/20 (2013.01); Y02E 60/13 (2013.01);
Abstract
The objective of the present invention is to provide a hydrogen-releasing film, a composite hydrogen-releasing film and a hydrogen-releasing laminated film that are not prone to embrittlement in the usage environmental temperatures of electrochemical elements. The hydrogen-releasing film containing an alloy, wherein the alloy is a Pd—Au alloy, and the Au content in the Pd—Au alloy is 15 mol % or more.