The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2019

Filed:

Mar. 17, 2016
Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Keiji Tatani, Kanagawa, JP;

Takuji Matsumoto, Kanagawa, JP;

Yasushi Tateshita, Kanagawa, JP;

Fumihiko Koga, Kanagawa, JP;

Takashi Nagano, Kanagawa, JP;

Takahiro Toyoshima, Kanagawa, JP;

Tetsuji Yamaguchi, Kanagawa, JP;

Keiichi Nakazawa, Tokyo, JP;

Naoyuki Miyashita, Kanagawa, JP;

Yoshihiko Nagahama, Kumamota, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/02 (2006.01); H01L 27/146 (2006.01); H01L 27/148 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1463 (2013.01); H01L 27/14689 (2013.01); H01L 27/14831 (2013.01); H01L 27/14609 (2013.01); H01L 27/14625 (2013.01); H01L 27/14627 (2013.01);
Abstract

Disclosed is a solid-state imaging device which includes a pixel section, a peripheral circuit section, a first isolation region formed with a STI structure on a semiconductor substrate in the peripheral circuit section, and a second isolation region formed with the STI structure on the semiconductor substrate in the pixel section. The portion of the second isolation region buried into the semiconductor substrate is shallower than the portion buried into the semiconductor substrate of the first isolation region, and the height of the upper face of the second isolation region is equal to that of the first isolation region. A method of producing the solid-state imaging device and an electronic device provided with the solid-state imaging devices are also disclosed.


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