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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10438907 B1

PDFFull Text
Date of Patent:
Oct. 08, 2019

Filed:

Dec. 11, 2016

Wireless package with antenna connector and fabrication method thereof

Applicant:

Cyntec Co., Ltd., Hsinchu, TW;

Inventors:

Chun-Fu Hu, Hsinchu, TW;

Chih-Yu Hu, Hsinchu, TW;

Shu-Wei Chang, Hsinchu, TW;

Assignee:

CYNTEC CO., LTD., Hsinchu, TW;

Attorney:

Winston Hsu

Primary Examiner:

Robert T Huber

Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/552 (2006.01); H01L 21/56 (2006.01); H01L 23/50 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/565 (2013.01); H01L 23/3128 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 23/50 (2013.01); H01L 23/552 (2013.01); H01L 2223/6605 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/97 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01);
Abstract

The present invention discloses a wireless package with a resilient connector for connecting a substrate to an antenna. The antenna is disposed directly on a top surface of a molding compound of the wireless package. The resilient connector has a lower terminal bonded to the substrate, a horizontal contact portion, and an oblique support portion integrally extending between the horizontal contact portion and the lower terminal. The horizontal contact portion has a flat top surface that is coplanar with the top surface of the molding compound and is in direct contact with the antenna such that the contact resistance distribution is concentrated and the production yield of the wireless package is improved.

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