The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2019
Filed:
Aug. 21, 2018
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Anna Katharina Krefft, Munich, DE;
Claus Reitlinger, Munich, DE;
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01L 23/08 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/4817 (2013.01); H01L 21/56 (2013.01); H01L 23/08 (2013.01);
Abstract
Some features pertain to a package that includes an enhanced electromagnetic shield. The package includes a substrate, an electronic component coupled to the substrate, and a mold partially surrounding the electronic component. The package further includes a first shield over the mold, and a second shield over the first shield. One of the first shield or the second shield is a high permeability shield and the remaining first or second shield is a high conductivity shield relative to the high permeability shield.