The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2019

Filed:

Aug. 30, 2016
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Siang Sin Foo, Singapore, SG;

Hiromitsu Kosugi, Singapore, SG;

Alejandro Aldrin A. Narag, II, Singapore, SG;

Ravi Palaniswamy, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H01L 33/62 (2010.01); H01L 21/48 (2006.01); H05K 1/11 (2006.01); H05K 3/32 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 21/4857 (2013.01); H01L 23/4985 (2013.01); H01L 23/49811 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/85 (2013.01); H01L 33/62 (2013.01); H05K 1/0269 (2013.01); H05K 1/189 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54486 (2013.01); H01L 2224/10175 (2013.01); H01L 2224/131 (2013.01); H01L 2224/1319 (2013.01); H01L 2224/26175 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/81132 (2013.01); H01L 2224/81385 (2013.01); H01L 2224/83132 (2013.01); H01L 2224/83385 (2013.01); H01L 2224/85132 (2013.01); H01L 2224/85385 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/0066 (2013.01); H05K 1/111 (2013.01); H05K 3/321 (2013.01); H05K 3/3436 (2013.01); H05K 2201/09745 (2013.01); H05K 2201/09918 (2013.01); H05K 2201/10106 (2013.01);
Abstract

A flexible multilayer construction () for mounting a light emitting semiconductor device () (LESD), includes a flexible dielectric substrate () having an LESD mounting region (), first and second electrically conductive pads () disposed in the LESD mounting region for electrically connecting to corresponding first and second electrically conductive terminals of an LESD () received in the LESD mounting region, and a first fiducial alignment mark () for an accurate placement of an LESD in the LESD mounting region. The first fiducial alignment mark is disposed within the LESD mounting region.


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