The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2019
Filed:
Mar. 13, 2018
Applicant:
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Inventors:
Jose Felixminia Palagud, Seremban, MY;
Soon Wei Wang, Seremban, MY;
Assignee:
Semiconductor Components Industries, LLC, Phoenix, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 23/49503 (2013.01); H01L 25/162 (2013.01);
Abstract
In a general aspect, a multi-chip semiconductor device package assembly can include a leadframe having a first die pad and a second die pad. The assembly can further include a first semiconductor die coupled to the first die pad and a second semiconductor die coupled to the second die pad. The assembly can also include a blank having a first portion coupled to the first die pad and a second portion coupled to the second die pad, such that the blank forms a bridge between the first die pad and the second die pad.