The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2019
Filed:
Mar. 23, 2018
Applicant:
Audi Ag, Ingolstadt, DE;
Inventor:
Roman Straßer, Gaimersheim, DE;
Assignee:
AUDI AG, Ingolstadt, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/473 (2006.01); H01L 23/373 (2006.01); H01L 23/44 (2006.01); H01L 25/18 (2006.01); H05K 7/20 (2006.01); B60L 15/00 (2006.01); H01M 10/625 (2014.01); H01M 10/6567 (2014.01); H01L 25/07 (2006.01); B60L 50/50 (2019.01); B60L 58/20 (2019.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); B60L 15/007 (2013.01); H01L 23/373 (2013.01); H01L 23/44 (2013.01); H01L 25/18 (2013.01); H05K 7/20927 (2013.01); H05K 7/20936 (2013.01); B60L 50/50 (2019.02); B60L 58/20 (2019.02); H01L 25/072 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01M 10/625 (2015.04); H01M 10/6567 (2015.04); H01M 2220/20 (2013.01);
Abstract
A power semiconductor module for a motor vehicle. a plurality of unhoused power semiconductor chips are provided, which are arranged so that a liquid coolant that is introduced into the power semiconductor module through a liquid coolant feed line can circulate directly around them.