The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2019
Filed:
Mar. 08, 2018
Martin Brokner Christiansen, Laurel, MD (US);
Leonard George Chorosinski, Ellicott City, MD (US);
Harlan Craig Heffner, Ellicott City, MD (US);
Stanley Katsuyoshi Wakamiya, Ellicott City, MD (US);
Keith R. Kirkwood, Columbia, MD (US);
Martin Brokner Christiansen, Laurel, MD (US);
Leonard George Chorosinski, Ellicott City, MD (US);
Harlan Craig Heffner, Ellicott City, MD (US);
Stanley Katsuyoshi Wakamiya, Ellicott City, MD (US);
Keith R. Kirkwood, Columbia, MD (US);
NORTHROP GRUMMAN SYSTEMS CORPORATION, Falls Church, VA (US);
Abstract
An apparatus for providing immersion cooling in a circuit card environment includes a circuit card having first and second longitudinally spaced circuit card subassemblies, connected together into a single circuit card oriented substantially in a lateral-longitudinal plane. The first and second circuit card subassemblies have first and second operating temperatures, respectively, which are different from one another. A thermal energy transfer device is operatively connected to an area of the circuit card correlated with a selected one of the first and second circuit card subassemblies. The thermal energy transfer device at least partially induces the respective one of the first and second operating temperatures to the selected circuit card subassembly. The thermal energy transfer device transversely overlies at least a supermajority of the selected circuit card subassembly and is laterally spaced from the other circuit card subassembly. A system and method for providing immersion cooling are also provided.