The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2019

Filed:

Jan. 08, 2014
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Masafumi Nakayama, Hokkaido, JP;

Yoshiya Sakaguchi, Kyoto, JP;

Hirofumi Yamada, Hokkaido, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/40 (2006.01); B32B 37/06 (2006.01); B32B 37/24 (2006.01); B32B 5/16 (2006.01); B32B 7/12 (2006.01); F16L 59/02 (2006.01); H01L 23/427 (2006.01); B32B 9/04 (2006.01); B32B 27/28 (2006.01); B32B 33/00 (2006.01); B32B 9/00 (2006.01); B32B 15/09 (2006.01); B32B 15/20 (2006.01); B32B 27/14 (2006.01); B32B 27/16 (2006.01); B32B 27/36 (2006.01); B32B 37/14 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4275 (2013.01); B32B 5/16 (2013.01); B32B 7/12 (2013.01); B32B 9/007 (2013.01); B32B 9/045 (2013.01); B32B 15/09 (2013.01); B32B 15/20 (2013.01); B32B 27/14 (2013.01); B32B 27/16 (2013.01); B32B 27/28 (2013.01); B32B 27/36 (2013.01); B32B 27/40 (2013.01); B32B 33/00 (2013.01); B32B 37/06 (2013.01); B32B 37/24 (2013.01); F16L 59/026 (2013.01); B32B 37/142 (2013.01); B32B 2037/243 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2260/025 (2013.01); B32B 2260/046 (2013.01); B32B 2264/00 (2013.01); B32B 2264/0214 (2013.01); B32B 2305/72 (2013.01); B32B 2307/302 (2013.01); B32B 2307/304 (2013.01); B32B 2307/732 (2013.01); B32B 2457/00 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A heat-insulating sheet includes a heat storage sheet, a first insulating sheet, and a thermally conductive sheet. The heat storage sheet contains a first resin and a plurality of microcapsules containing latent heat storage material and mixed in the form of aggregates with each other. The first insulating sheet has a first face bonded to the heat storage sheet and a second face opposite to the first face. The thermally conductive sheet is bonded to the second face of the first insulating sheet. The content of the microcapsules in the heat storage sheet is falls within a range from 40 wt % to 90 wt %, inclusive. The heat storage sheet includes a layer free from the microcapsules at a portion in contact with the first insulating sheet.


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