The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2019
Filed:
Dec. 24, 2015
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Yasuo Morimoto, Tokyo, JP;
Hideharu Yoshioka, Tokyo, JP;
Akimichi Hirota, Tokyo, JP;
Naofumi Yoneda, Tokyo, JP;
Takuma Ishibashi, Tokyo, JP;
Assignee:
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01); H01L 23/02 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01L 23/367 (2006.01); H01L 23/12 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
H01L 23/04 (2013.01); H01L 23/02 (2013.01); H01L 23/12 (2013.01); H01L 23/36 (2013.01); H01L 23/367 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 23/3677 (2013.01); H01L 2223/6627 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/1615 (2013.01); H01L 2924/16152 (2013.01); H01L 2924/16235 (2013.01); H01L 2924/16251 (2013.01);
Abstract
A recess in a metal housing accommodating a high frequency package includes a first space and a second space and has a winners podium shape in cross-sectional view. A thermally conductive material is sandwiched between the metal housing having heat dissipating fins and the high frequency package.