The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2019

Filed:

Apr. 22, 2016
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Amit Kumar Bansal, Milpitas, CA (US);

Juan Carlos Rocha, San Carlos, CA (US);

Karthik Janakiraman, San Jose, CA (US);

Tuan Anh Nguyen, San Jose, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/458 (2006.01); H01L 21/66 (2006.01); H01L 21/02 (2006.01); H01L 21/285 (2006.01); H01L 21/687 (2006.01); C23C 16/455 (2006.01); C23C 16/52 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 22/26 (2013.01); C23C 16/4583 (2013.01); C23C 16/45565 (2013.01); C23C 16/45589 (2013.01); C23C 16/52 (2013.01); H01L 21/0262 (2013.01); H01L 21/02271 (2013.01); H01L 21/28556 (2013.01); H01L 21/67253 (2013.01); H01L 21/68742 (2013.01); H01L 21/68764 (2013.01); H01L 21/68785 (2013.01); H01L 22/12 (2013.01);
Abstract

The implementations described herein generally relate to steps for the dynamic, real-time control of the process spacing between a substrate support and a gas distribution medium during a deposition process. Multiple dimensional degrees of freedom are utilized to change the angle and spacing of a substrate plane with respect to the gas distributing medium at any time during the deposition process. As such, the substrate and/or substrate support may be leveled, tilted, swiveled, wobbled, and/or moved during the deposition process to achieve improved film uniformity. Furthermore, the independent tuning of each layer may be had due to continuous variations in the leveling of the substrate plane with respect to the showerhead to average effective deposition on the substrate, thus improving overall stack deposition performance.


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