The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2019

Filed:

Nov. 29, 2017
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Yoon Tae Hwang, Seoul, KR;

Moon Kyun Song, Anyang-si, KR;

Nam Gyu Cho, Seoul, KR;

Kyu Min Lee, Hwaseong-si, KR;

Soo Jung Choi, Seoul, KR;

Yong Ho Ha, Hwaseong-si, KR;

Sang Jin Hyun, Suwon-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/28 (2006.01); H01L 29/51 (2006.01); H01L 21/02 (2006.01); H01L 21/8238 (2006.01); H01L 27/092 (2006.01); H01L 29/423 (2006.01); H01L 29/49 (2006.01); H01L 29/775 (2006.01); B82Y 10/00 (2011.01); H01L 29/06 (2006.01); H01L 29/786 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/28185 (2013.01); B82Y 10/00 (2013.01); H01L 21/022 (2013.01); H01L 21/0228 (2013.01); H01L 21/02164 (2013.01); H01L 21/02532 (2013.01); H01L 21/28176 (2013.01); H01L 21/82385 (2013.01); H01L 21/823821 (2013.01); H01L 21/823842 (2013.01); H01L 21/823857 (2013.01); H01L 27/092 (2013.01); H01L 27/0924 (2013.01); H01L 29/0673 (2013.01); H01L 29/42364 (2013.01); H01L 29/42392 (2013.01); H01L 29/4966 (2013.01); H01L 29/513 (2013.01); H01L 29/517 (2013.01); H01L 29/775 (2013.01); H01L 29/78696 (2013.01); H01L 21/02238 (2013.01); H01L 21/02576 (2013.01); H01L 21/02579 (2013.01); H01L 21/28194 (2013.01); H01L 29/7848 (2013.01);
Abstract

Semiconductor devices and methods for fabricating the same are provided. A semiconductor device may include a substrate including first and second regions, a first interface film disposed on the substrate in the first region, a second interface film disposed on the substrate in the second region, a dielectric film disposed on the first and second interface films, a first metal film disposed on the dielectric film in the first region, and a second metal film disposed on the dielectric film in the second region. The first and second interface films may comprise an oxide of the substrate, the first and second metal films may comprise different materials, and the first and second interface films may have different thicknesses. Channels may be provided in the first and second regions, and the channels may be fin-shaped or wire-shaped. The metal films may have different oxygen content.


Find Patent Forward Citations

Loading…