The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2019

Filed:

Jan. 29, 2019
Applicant:

Sean Sullivan, Austin, TX (US);

Inventor:

Sean Sullivan, Austin, TX (US);

Assignee:

Other;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/01 (2006.01); G01K 13/00 (2006.01); G08B 6/00 (2006.01); G09B 21/00 (2006.01); H01L 35/02 (2006.01); H01L 35/28 (2006.01); H01L 25/04 (2014.01);
U.S. Cl.
CPC ...
G06F 3/016 (2013.01); G01K 13/002 (2013.01); G06F 3/011 (2013.01); G06F 3/014 (2013.01); G08B 6/00 (2013.01); G09B 21/003 (2013.01); H01L 25/04 (2013.01); H01L 35/02 (2013.01); H01L 35/28 (2013.01);
Abstract

A device for providing thermoreceptive haptic feedback includes a first array of low mass elements, arranged in a geometric pattern, the array having a first temperature and a first collective thermal effusivity, and configured for selectively contacting a user, a second array of low mass elements, interspersed among the low mass elements of the first array, and thermally isolated from the low mass elements the first array, the array having a second temperature and a second collective thermal effusivity, and configured for selectively contacting a user, and a means for mechanical switching coupled to the low mass elements of the first and the second arrays and configured to place selected low mass elements of the first and the second arrays in contact with a user, to realize a thermal effusivity between the first collective thermal effusivity and the second collective thermal effusivity.


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