The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2019

Filed:

Jul. 10, 2018
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventor:

Tae Min Ha, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03B 13/36 (2006.01); G03B 17/02 (2006.01); H04N 5/225 (2006.01); H04N 5/232 (2006.01); G03B 3/10 (2006.01); G02F 1/29 (2006.01);
U.S. Cl.
CPC ...
G03B 13/36 (2013.01); G02F 1/29 (2013.01); G03B 3/10 (2013.01); G03B 17/02 (2013.01); H04N 5/2252 (2013.01); H04N 5/2253 (2013.01); H04N 5/2254 (2013.01); H04N 5/2257 (2013.01); H04N 5/23264 (2013.01); G03B 2205/0007 (2013.01); G03B 2205/0053 (2013.01);
Abstract

The present invention relates to a camera module comprising: a printed circuit board having an image sensor mounted thereon; a holder member provided on the printed circuit board and having a lens barrel provided therein; an optical module arranged on the upper side of the holder member and performing an auto-focusing function and/or an image stabilization function; and an electric current applying unit for electrically connecting the printed circuit board and the optical module, wherein the electric current applying unit comprises: first and second conductive members connected to the printed circuit board; and first and second plate members which are arranged on the upper side of the holder member and are electrically connected to each of the first and second conductive members, and which are electrically connected through the optical module. Through the present invention, a separate circuit board for applying a power source to an optical module is not required, and thus, it is possible to lower the height of the camera module as much as the thickness of a circuit board.


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