The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2019

Filed:

Jan. 26, 2015
Applicant:

Omnivision Technologies, Inc., Santa Clara, CA (US);

Inventors:

Tsung-Wei Wan, HsinChu, TW;

Wei-Ping Chen, New Taipei, TW;

Jui-Yi Chiu, Zhubei, TW;

Jau-Jan Deng, Taipei, TW;

Assignee:

OmniVision Technologies, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 13/00 (2006.01); B29D 11/00 (2006.01); B29C 45/00 (2006.01); B29C 45/14 (2006.01); B29L 11/00 (2006.01);
U.S. Cl.
CPC ...
G02B 13/0085 (2013.01); B29C 45/0053 (2013.01); B29C 45/14336 (2013.01); B29C 45/14778 (2013.01); B29D 11/00807 (2013.01); B29C 2045/14868 (2013.01); B29D 11/00307 (2013.01); B29L 2011/0016 (2013.01);
Abstract

A method for packaging applies to packaging a plurality of wafer-level lenses. Each wafer-level lens includes (a) a substrate with opposite facing first and second surfaces and (b) a respective lens element on at least one of the first and second surfaces. Each lens element has a lens surface facing away from the substrate. The method includes partially encasing the plurality of wafer-level lenses with a housing material to produce a wafer of packaged wafer-level lenses. In the wafer of packaged wafer-level lenses, the housing material supports each of the plurality of wafer-level lenses by contacting the respective substrate, and the housing is shaped to form a plurality of housings for the plurality of wafer-level lenses, respectively.


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