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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10436663 B1

PDFFull Text
Date of Patent:
Oct. 08, 2019

Filed:

Sep. 28, 2014

Semiconductor pressure sensor including improved structure and integrated sensor chip

Applicant:

Wuhan Finemems Inc., Wuhan, Hubei, CN;

Inventors:

Sheng Liu, Hubei, CN;

Xiaoping Wang, Hubei, CN;

Dengfeng Wu, Hubei, CN;

Fanliang Li, Hubei, CN;

Bin Chen, Hubei, CN;

Assignee:

WUHAN FINEMEMS INC., Hubei, CN;

Attorney:

Muncy, Geissler, Olds & Lowe, P.C.

Primary Examiner:

Harshad R Patel

Assistant Examiner:

Nigel H Plumb

Int. Cl.
CPC ...
G01L 19/00 (2006.01); G01L 19/14 (2006.01); G01L 9/06 (2006.01); G01L 9/00 (2006.01);
U.S. Cl.
CPC ...
G01L 19/141 (2013.01); G01L 9/0054 (2013.01); G01L 9/06 (2013.01); G01L 19/0038 (2013.01); G01L 19/0084 (2013.01); G01L 19/145 (2013.01); G01L 19/147 (2013.01);
Abstract

A pressure sensor has a housing, an air lead-in hole, a pressure lead-in hole, an inner cavity, a sensor chip, a lead frame and a cover plate. One end of the air lead-in hole is in communication with the inner cavity of the housing, and the other end of the air lead-in hole is in communication with the air; the pressure lead-in hole is perpendicularly disposed at the center of the upper surface of the housing, two steps are disposed on the upper surface of the inner cavity, and a horizontal surface-mounted device surface is disposed on each of the steps. The center of the sensor chip is aligned with the centers of the pressure lead-in hole, and the lower end of the pressure lead-in holes are in communication with the cavity of the sensor chip.

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Liu, Sheng. (2019). Semiconductor pressure sensor including improved structure and integrated sensor chip (U.S. Patent No. 10436663). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10436663

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