The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10435796 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 08, 2019

Filed:

Aug. 09, 2017
Applicant:

Corning Incorporated, Corning, NY (US);

Inventors:

Jeffrey John Domey, Elmira, NY (US);

John Tyler Keech, Painted Post, NY (US);

Xinghua Li, Horseheads, NY (US);

Garrett Andrew Piech, Corning, NY (US);

Aric Bruce Shorey, Pittsford, NY (US);

Paul John Shustack, Elmira, NY (US);

John Christopher Thomas, Elmira, NY (US);

Assignee:

Corning Incorporated, Corning, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/26 (2006.01); B32B 7/04 (2019.01); B23B 7/06 (2006.01); B32B 17/06 (2006.01); C23F 4/04 (2006.01); C03B 33/10 (2006.01); H05K 3/00 (2006.01); C03B 33/02 (2006.01); B23K 26/18 (2006.01); B23K 26/0622 (2014.01); B23K 26/386 (2014.01); B23K 26/40 (2014.01); B23K 26/382 (2014.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
C23F 4/04 (2013.01); B23K 26/0622 (2015.10); B23K 26/18 (2013.01); B23K 26/386 (2013.01); B23K 26/389 (2015.10); B23K 26/40 (2013.01); C03B 33/0222 (2013.01); C03B 33/102 (2013.01); H05K 3/0026 (2013.01); B23K 2103/50 (2018.08); B23K 2103/54 (2018.08); Y10T 428/24322 (2015.01);
Abstract

A method for forming a plurality of precision holes in a substrate by drilling, including affixing a sacrificial cover layer to a surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location of one of the plurality of precision holes, forming a through hole in the sacrificial cover layer by repeatedly pulsing a laser beam at the predetermined location, and pulsing the laser beam into the through hole formed in the sacrificial cover layer. A work piece having precision holes including a substrate having the precision holes formed therein, wherein a longitudinal axis of each precision hole extends in a thickness direction of the substrate, and a sacrificial cover layer detachably affixed to a surface of the substrate, such that the sacrificial cover layer reduces irregularities of the precision holes.


Find Patent Forward Citations

Loading…