The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2019

Filed:

Mar. 29, 2016
Applicant:

Tesa SE, Norderstedt, DE;

Inventors:

Anna Blazejewski, Hamburg, DE;

Axel Burmeister, Hamburg, DE;

Franciska Lohmann, Hamburg, DE;

Anika Petersen, Bimöhlen, DE;

Assignee:

TESA SE, Norderstedt, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/38 (2018.01); C09J 7/10 (2018.01); C09J 7/20 (2018.01); C09J 5/00 (2006.01); C09J 11/08 (2006.01); C09J 153/02 (2006.01); C09J 5/08 (2006.01); C08K 5/01 (2006.01); C08K 7/20 (2006.01); B29B 7/48 (2006.01);
U.S. Cl.
CPC ...
C09J 7/387 (2018.01); B29B 7/485 (2013.01); B29B 7/487 (2013.01); C08K 5/01 (2013.01); C08K 7/20 (2013.01); C09J 5/00 (2013.01); C09J 5/08 (2013.01); C09J 7/10 (2018.01); C09J 7/20 (2018.01); C09J 11/08 (2013.01); C09J 153/02 (2013.01); C08K 2201/005 (2013.01); C08L 2205/20 (2013.01); C09J 2201/122 (2013.01); C09J 2201/128 (2013.01); C09J 2201/60 (2013.01); C09J 2201/606 (2013.01); C09J 2201/618 (2013.01); C09J 2203/322 (2013.01); C09J 2203/326 (2013.01); C09J 2205/102 (2013.01); C09J 2205/11 (2013.01); C09J 2205/114 (2013.01); C09J 2425/00 (2013.01); C09J 2453/00 (2013.01);
Abstract

The invention relates to a pressure-sensitive adhesive strip, for the residue-free and nondestructive removal by which by substantially expanding it in the plane of adhesion, comprising an adhesive compound layer, said adhesive compound layer consisting of a pressure-sensitive adhesive compound, constituted by vinyl aromatic block copolymers and adhesive resins, at least 75 wt.-% (relative to the total amount of resin) of a resin being selected that has a DACP (diacetone alcohol cloud point) of greater than −20° C., preferably greater than 0° C., and a softening point (ring & ball) of greater than or equal to 70° C., preferably greater than or equal to 100° C., and the pressure-sensitive adhesive compound being foamed.


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