The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2019
Filed:
Feb. 21, 2014
Applicant:
Dic Corporation, Tokyo, JP;
Inventors:
Yutaka Satou, Ichihara, JP;
Ayumi Takahashi, Ichihara, JP;
Assignee:
DIC Corporation, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C07D 303/30 (2006.01); C08G 59/32 (2006.01); H05K 1/09 (2006.01); C07D 407/14 (2006.01); C07D 307/92 (2006.01); H05K 1/03 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
C07D 303/30 (2013.01); C07D 307/92 (2013.01); C07D 407/14 (2013.01); C08G 59/32 (2013.01); C08G 59/3218 (2013.01); H01L 23/295 (2013.01); H05K 1/0326 (2013.01); H05K 1/0366 (2013.01); H05K 1/09 (2013.01); H01L 2924/0002 (2013.01); H05K 1/0373 (2013.01); H05K 2201/012 (2013.01);
Abstract
There is provided an epoxy compound whose melt viscosity is low and which exhibits heat resistance and flame retardancy of a cured product; an epoxy resin which includes the same; curable composition and cured product; and semiconductor sealing material. The epoxy compound has a molecular structure represented by the following Formula (I):
Satou, Yutaka. (2019). Epoxy compound, epoxy resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board (U.S. Patent No. 10435382). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10435382
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile