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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10434750 B1

PDFFull Text
Date of Patent:
Oct. 08, 2019

Filed:

Jan. 13, 2016

Resin film for flexible printed circuit board, metal foil provided with resin, coverlay film, bonding sheet, and flexible printed circuit board

Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Masaki Takeuchi, Tokyo, JP;

Yoshitsugu Matsuura, Tokyo, JP;

Yuta Nakano, Tokyo, JP;

Kazuhito Obata, Tokyo, JP;

Katsuhiko Yasu, Tokyo, JP;

Assignee:

HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;

Attorney:

Fitch, Even, Tabin & Flannery, L.L.P.

Primary Examiner:

Timothy J Thompson

Assistant Examiner:

Guillermo J Egoavil

Int. Cl.
CPC ...
B32B 15/088 (2006.01); B32B 27/26 (2006.01); C08L 35/00 (2006.01); G03F 7/004 (2006.01); H05K 1/02 (2006.01); H05K 3/06 (2006.01); H05K 3/18 (2006.01); B32B 15/08 (2006.01); B32B 27/34 (2006.01); C08K 5/00 (2006.01); C09D 179/08 (2006.01); C08G 73/12 (2006.01); C08L 79/08 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
B32B 15/088 (2013.01); B32B 15/08 (2013.01); B32B 27/26 (2013.01); B32B 27/34 (2013.01); C08G 73/128 (2013.01); C08K 5/00 (2013.01); C08L 35/00 (2013.01); C08L 79/085 (2013.01); C09D 179/085 (2013.01); H05K 1/028 (2013.01); H05K 3/386 (2013.01); C08L 2203/16 (2013.01); C08L 2203/20 (2013.01); C08L 2205/025 (2013.01); C08L 2205/05 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0195 (2013.01);
Abstract

The present invention relates to a resin film for a flexible printed circuit board consisting of a resin composition containing: a long-chain alkyl bismaleimide resin having a main chain containing an alkylene chain having 10 or more carbon atoms and a side chain containing an alkyl group bonded to the alkylene chain; and a curing agent having two or more functional groups reacting with the long-chain alkyl bismaleimide resin.

Find Patent Forward Citations

Takeuchi, Masaki. (2019). Resin film for flexible printed circuit board, metal foil provided with resin, coverlay film, bonding sheet, and flexible printed circuit board (U.S. Patent No. 10434750). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10434750

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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