The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2019

Filed:

May. 11, 2018
Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Koju Ito, Minamiashigara, JP;

Souichi Kohashi, Minamiashigara, JP;

Hiroshi Yabu, Sendai, JP;

Kuniaki Nagamine, Sendai, JP;

Matsuhiko Nishizawa, Sendai, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 7/02 (2019.01); C08J 9/26 (2006.01); C08J 9/36 (2006.01); H01B 5/14 (2006.01); H05K 9/00 (2006.01); B32B 3/12 (2006.01); C08J 9/28 (2006.01);
U.S. Cl.
CPC ...
B32B 7/02 (2013.01); B32B 3/12 (2013.01); C08J 9/26 (2013.01); C08J 9/28 (2013.01); C08J 9/36 (2013.01); C08J 9/365 (2013.01); H01B 5/14 (2013.01); H05K 9/00 (2013.01); C08J 2201/0502 (2013.01); C08J 2309/00 (2013.01); C08J 2383/04 (2013.01); C08J 2400/26 (2013.01); C08J 2433/26 (2013.01); Y10T 428/24967 (2015.01);
Abstract

There is provided a conductive film having conductivity in a surface direction, being deformable, having excellent durability, and transmitting visible light. A conductive film includes a film substrate and a conductive material layer. The conductive material layer is provided on a first substrate surface of the film substrate. A plurality of through holes penetrating the film substrate and the conductive material layer in a thickness direction are formed in the conductive film. The conductive material layer has a plurality of conductive portions, and the conductive portions are present between adjacent layer opening portions. The number of the conductive portion is 400 per 1 mm, and an opening ratio of the conductive material layer is at least 40%.


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