The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2019
Filed:
Jul. 16, 2014
Daicel Polymer Ltd., Tokyo, JP;
Daicel Corporation, Osaka-shi, Osaka, JP;
Daiji Ikeda, Himeji, JP;
Yoshihiro Asami, Himeji, JP;
DAICEL POLYMER LTD., Tokyo, JP;
DAICEL CORPORATION, Osaka-shi, Osaka, JP;
Abstract
A composite molded article contains a metal molded article and a resin molded article, which are bonded to each other, in which the metal molded article has a roughened bonding surface, a surface layer portion of the metal molded article including the roughened bonding surface has: open holes containing: a stem hole that is formed in a thickness direction and has an opening on the side of the bonding surface, and a branch hole that is formed from an inner wall of the stem hole in a different direction from the stem hole, and the composite molded article is bonded in such a state that the resin permeates into the open holes formed on the bonding surface of the metal molded article.