The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2019
Filed:
Apr. 11, 2016
Fujifilm Corporation, Tokyo, JP;
Yoshiki Sakazaki, Kanagawa, JP;
FUJIFILM Corporation, Minato-Ku, Tokyo, JP;
Abstract
A bonding target object and a film including a layer having lower toughness than the bonding target object are disposed between a set of pressurization molds, which have pressurization surfaces disposed so as to face each other and in which opening holes are formed in the pressurization surfaces. A first edge on the opening hole side of the pressurization surface of a first pressurization mold, out of the set of pressurization molds, which faces the film is positioned further inside the opening hole than a second edge on the opening hole side of the pressurization surface of a second pressurization mold which faces the bonding target object. The pressing target portion of the film which is pressed by the set of pressurization molds is bonded to the bonding target object by sandwiching the bonding target object and the film with the set of pressurization molds to be pressed.