The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2019
Filed:
Jun. 23, 2017
Canon Kabushiki Kaisha, Tokyo, JP;
Yasushi Iijima, Tokyo, JP;
Yukuo Yamaguchi, Tokyo, JP;
Mikiya Umeyama, Tokyo, JP;
Satoshi Oikawa, Yokohama, JP;
Hiromasa Amma, Kawasaki, JP;
Takuya Iwano, Inagi, JP;
Satoshi Kimura, Kawasaki, JP;
Naoko Tsujiuchi, Kawasaki, JP;
Kyosuke Toda, Kawasaki, JP;
CANON KABUSHIKI KAISHA, Tokyo, JP;
Abstract
A resin molding method includes a first molding step of molding a first molded part and a second molded part in a mold and a second molding step of joining the first molded part and the second molded part. In the first molding step, the second molded part is formed by injecting resin into an area where a first core movable in the first direction and a second core movable in a second direction are engaged. In the second molding step, the second molded part is joined to the first molded part by injecting the resin while the first core is in contact with the second molded part and the second core is removed from the second molded part. Areas where the first core and the second core are located in the first molding step become hollow areas connected to each other and part of ends of the first core in the first direction is not in contact with the second core.