The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2019

Filed:

May. 20, 2016
Applicants:

Sharp Kabushiki Kaisha, Sakai, Osaka, JP;

Denka Company Limited, Chuo-ku, Tokyo, JP;

Inventors:

Youhei Nakanishi, Sakai, JP;

Masayuki Kanehiro, Sakai, JP;

Hiroyuki Kurimura, Shibukawa, JP;

Yasunori Ishida, Shibukawa, JP;

Takuya Amada, Shinagawa-ku, JP;

Koji Hashimoto, Shinagawa-ku, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 5/04 (2006.01); G02F 1/13 (2006.01); B24B 9/14 (2006.01); B24B 13/015 (2006.01); G02F 1/1333 (2006.01); G02F 1/1339 (2006.01);
U.S. Cl.
CPC ...
B24B 5/042 (2013.01); B24B 9/14 (2013.01); B24B 13/015 (2013.01); G02F 1/13 (2013.01); G02F 1/1339 (2013.01); G02F 1/133351 (2013.01); G02F 2201/56 (2013.01); G02F 2202/023 (2013.01);
Abstract

A method of collectively producing display panels each having an outline a part of which is curved includes a bonded substrate forming process of bonding substrates in a pair one of which has thin film patterns and forming a bonded substrate, a layering process of layering multiple bonded substratesvia curing resinand curing the curing resin, a grinding process of collectively grinding the substrates in a pair and the curing resinthat are outside the thin film pattern on each of the bonded substratesB that are layered on each other along the outline and collectively forming edge surfaces of the display panels each having the curved outline, and a separation process of separating each of the bonded substratesB that are layered on each other from the curing resin


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