The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2019
Filed:
May. 21, 2014
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Ken Tachibana, Chiba-ken, JP;
Yuya Nagasawa, Hyogo-ken, JP;
Assignee:
Senju Metal Indsutry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 13/02 (2006.01); B23K 35/26 (2006.01); C22C 13/00 (2006.01); H01L 23/00 (2006.01); B23K 35/02 (2006.01); H01L 23/498 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B23K 35/0244 (2013.01); C22C 13/00 (2013.01); C22C 13/02 (2013.01); H01L 24/13 (2013.01); B23K 2101/40 (2018.08); H01L 23/49816 (2013.01); H01L 23/49866 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48229 (2013.01); H01L 2924/15311 (2013.01);
Abstract
Lead-free solder is characterized in that the lead-free solder contains Ag of 1.2 mass % through 4.5 mass %, Cu of 0.25 mass % through 0.75 mass %, Bi of 1 mass % through 5.8 mass %, Ni of 0.01 mass % through 0.15 mass % and Sn as the remainder. These addition amounts allow to be further improved the common solder properties such as wettability, shear strength properties and the like, in addition to the thermal fatigue resistance.