The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2019

Filed:

Aug. 03, 2017
Applicant:

Guangdong Oppo Mobile Telecommunications Corp., Ltd., Dongguan, Guangdong, CN;

Inventor:

Wenzhen Zhang, Guangdong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 5/117 (2016.01); G01B 7/28 (2006.01); G06K 19/08 (2006.01); G01B 11/24 (2006.01); H01L 27/146 (2006.01); H04M 1/02 (2006.01); A61B 5/00 (2006.01); G06K 9/00 (2006.01); G06F 1/16 (2006.01);
U.S. Cl.
CPC ...
A61B 5/117 (2013.01); G01B 7/28 (2013.01); G01B 11/24 (2013.01); G06K 19/08 (2013.01); H01L 27/146 (2013.01); H04M 1/026 (2013.01); A61B 5/00 (2013.01); G06F 1/1684 (2013.01); G06K 9/00 (2013.01); H04M 2250/12 (2013.01);
Abstract

A fingerprint sensor and a related terminal are provided. The fingerprint sensor includes a chip assembly and a protection element. The chip assembly includes a circuit board and a sealing element laminated on the circuit board. The protection assembly includes a first protection element. The circuit board is engaged with the first protection element to define a space to receive the sealing element, or the sealing element is engaged with the first protection element to define a space to receive the circuit board.


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