The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2019

Filed:

Aug. 17, 2017
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Noboru Kato, Nagaokakyo, JP;

Kunihiro Komaki, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 13/00 (2006.01); G06K 19/07 (2006.01); G06K 19/077 (2006.01); G09F 3/00 (2006.01); H01Q 1/22 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 13/003 (2013.01); G06K 19/07 (2013.01); G06K 19/077 (2013.01); G06K 19/0776 (2013.01); G06K 19/07775 (2013.01); G09F 3/00 (2013.01); H01Q 1/2208 (2013.01); H05K 1/185 (2013.01); H05K 2201/10098 (2013.01);
Abstract

A method for manufacturing a carrier tape housing a plurality of electronic components with seal materials includes forming housing holes in tape-shaped main body with first and second principal surfaces along a longitudinal direction of the tape-shaped main body, the housing holes penetrating from the first principal surface to the second principal surface, affixing an adhesive layer of a tape-shaped seal material to the second principal surface of the tape-shaped main body to cover the housing holes, forming cuts in the tape-shaped seal material to separate portions defining and functioning as the seal materials including portions at least partially overlapping with the respective housing holes in a planar view from the other portions, and providing chip-shaped electronic component into each of the housing holes of the tape-shaped main body and fixing the electronic component to the adhesive layer of the seal material exposed in each of the housing holes.


Find Patent Forward Citations

Loading…