The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2019
Filed:
Sep. 14, 2018
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventor:
Joungphil Lee, Suwon-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H05K 9/00 (2006.01); H01L 23/31 (2006.01); B32B 17/06 (2006.01); B32B 15/04 (2006.01); B32B 7/12 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0086 (2013.01); B32B 7/12 (2013.01); B32B 15/04 (2013.01); B32B 17/064 (2013.01); H01L 23/3114 (2013.01); H01L 23/3128 (2013.01); H01L 23/552 (2013.01); H05K 9/0094 (2013.01);
Abstract
A semiconductor package including a package substrate including a ground layer, a first segment of which is exposed to outside the package substrate, a semiconductor chip on the package substrate, and a functional layer including a conductive polymer and an adhesive polymer, covering the semiconductor chip, and being in contact with the first segment of the ground layer may be provided.
Lee, Joungphil. (2019). Semiconductor package and semiconductor module (U.S. Patent No. 10433469). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10433469
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile