The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2019

Filed:

Oct. 20, 2011
Applicants:

Christopher D. Prest, San Francisco, CA (US);

Joseph Poole, San Francisco, CA (US);

Joseph W. Stevick, North Tustin, CA (US);

Quoc Tran Pham, Anaheim, CA (US);

Theodore Andrew Waniuk, Lake Forest, CA (US);

Inventors:

Christopher D. Prest, San Francisco, CA (US);

Joseph Poole, San Francisco, CA (US);

Joseph W. Stevick, North Tustin, CA (US);

Quoc Tran Pham, Anaheim, CA (US);

Theodore Andrew Waniuk, Lake Forest, CA (US);

Assignees:

Crucible Intellectual Property, LLC, Rancho Santa Margarita, CA (US);

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); C22C 45/00 (2006.01); C22C 45/10 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 21/48 (2006.01); B21D 22/02 (2006.01); B21D 22/04 (2006.01); B23P 19/00 (2006.01); C21D 9/00 (2006.01); C23C 16/27 (2006.01); C23C 16/44 (2006.01); C23C 16/513 (2006.01); F25B 21/02 (2006.01); F28F 21/08 (2006.01); H01L 23/427 (2006.01); H01L 23/467 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01); B21D 22/02 (2013.01); B21D 22/04 (2013.01); B23P 19/00 (2013.01); C21D 9/0006 (2013.01); C22C 45/00 (2013.01); C22C 45/003 (2013.01); C22C 45/10 (2013.01); C23C 16/27 (2013.01); C23C 16/44 (2013.01); C23C 16/513 (2013.01); F25B 21/02 (2013.01); F28F 21/085 (2013.01); F28F 21/086 (2013.01); F28F 21/087 (2013.01); H01L 21/4871 (2013.01); H01L 23/3672 (2013.01); H01L 23/3736 (2013.01); H01L 23/427 (2013.01); H01L 23/467 (2013.01); H01L 23/473 (2013.01); H01L 2924/0002 (2013.01); H05K 7/20 (2013.01); Y10T 29/49826 (2015.01);
Abstract

Embodiments herein relate to a heat sink having nano- and/or micro-replication directly embossed in a bulk solidifying amorphous alloy comprising a metal alloy, wherein the heat sink is configured to transfer heat out of the heat sink by natural convection by air or forced convection by air, or by fluid phase change of a fluid and/or liquid cooling by a liquid. Other embodiments relate apparatus having the heat sink. Yet other embodiments relate to methods of manufacturing the heat sink and apparatus having the heat sink.


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