IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10433427 B1

PDFFull Text
Date of Patent:
Oct. 01, 2019

Filed:

Jun. 02, 2015

Method for firing copper paste

Applicant:

Material Concept, Inc., Sendai-shi, Miyagi, JP;

Inventors:

Junichi Koike, Sendai, JP;

Yuji Sutou, Sendai, JP;

Daisuke Ando, Sendai, JP;

Assignee:

MATERIAL CONCEPT, INC., Sendai-Shi, Miyagi, JP;

Attorney:

Cantor Colburn LLP

Primary Examiner:

Tabatha L Penny

Int. Cl.
CPC ...
H05K 3/12 (2006.01); B05D 3/04 (2006.01); B22F 3/10 (2006.01); B05D 3/02 (2006.01); H01B 1/22 (2006.01); H01B 5/02 (2006.01); H01B 5/14 (2006.01); H01B 13/00 (2006.01); H01L 21/48 (2006.01); H01B 1/00 (2006.01); B22F 1/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/1291 (2013.01); B05D 3/02 (2013.01); B05D 3/04 (2013.01); B22F 3/10 (2013.01); B22F 3/1007 (2013.01); B22F 3/1017 (2013.01); H01B 1/22 (2013.01); H01B 5/02 (2013.01); H01B 5/14 (2013.01); H01B 13/00 (2013.01); H01L 21/4867 (2013.01); B22F 1/0048 (2013.01); B22F 2001/0066 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); H01B 1/00 (2013.01); H05K 2203/1157 (2013.01); H05K 2203/1476 (2013.01);
Abstract

To provide a method for firing a copper paste, which improves sinterability of copper particles for the purpose of forming a copper wiring line that is decreased in the electrical conductivity. A method for firing a copper paste, which comprises: an application step wherein a copper paste is applied over a substrate; a first heating step wherein the substrate is heated in a nitrogen gas atmosphere containing from 500 ppm to 2,000 ppm (inclusive) of an oxidizing gas in terms of volume ratio after the application step, thereby oxidizing and sintering copper particles in the copper paste; and a second heating step wherein the substrate is heated in a nitrogen gas atmosphere containing 1% or more of a reducing gas in terms of volume ratio after the first heating step, thereby reducing the oxidized and sintered copper oxide.

Find Patent Forward Citations

Loading…