The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2019
Filed:
Aug. 31, 2015
Applicant:
General Electric Company, Schenectady, NY (US);
Inventors:
Christopher James Kapusta, Delanson, NY (US);
Marco Francesco Aimi, Schenectady, NY (US);
Assignee:
GENERAL ELECTRIC COMPANY, Niskayuna, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 9/02 (2006.01); H03H 9/10 (2006.01); H03H 9/19 (2006.01); H03H 3/08 (2006.01); H03H 9/05 (2006.01); G01L 3/10 (2006.01); G01L 1/16 (2006.01); H03H 3/04 (2006.01);
U.S. Cl.
CPC ...
H03H 9/02535 (2013.01); G01L 1/165 (2013.01); G01L 3/10 (2013.01); H03H 3/08 (2013.01); H03H 9/058 (2013.01); H03H 9/0595 (2013.01); H03H 9/10 (2013.01); H03H 9/1064 (2013.01); H03H 9/19 (2013.01); H03H 2003/0478 (2013.01);
Abstract
In one embodiment, a bonded quartz wafer package includes a first quartz wafer including at least one quartz-based device, a second quartz wafer disposed above the first quartz wafer, and a liquid crystal polymer (LCP) bonding layer disposed in between the first and second quartz wafers that bonds the first and second quartz wafers together.