The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2019

Filed:

Jul. 19, 2017
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Jan Seidenfaden, Neumarkt i.d. Oberpfalz, DE;

Jan Marfeld, Regensburg, DE;

Hubert Schmid, Painten, DE;

Soenke Tautz, Tegernheim, DE;

Roland Enzmann, Regensburg, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/00 (2006.01); H01S 5/022 (2006.01); H01S 5/024 (2006.01); H01S 5/40 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02244 (2013.01); H01S 5/005 (2013.01); H01S 5/0092 (2013.01); H01S 5/02268 (2013.01); H01S 5/02272 (2013.01); H01S 5/02276 (2013.01); H01S 5/02296 (2013.01); H01S 5/02438 (2013.01); H01S 5/02484 (2013.01); H01S 5/4093 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73265 (2013.01); H01S 5/0224 (2013.01); H01S 5/02212 (2013.01); H01S 5/02252 (2013.01); H01S 5/02469 (2013.01); H01S 2301/176 (2013.01);
Abstract

A laser component includes a housing, a laser chip arranged in the housing, and a conversion element for radiation conversion arranged in the housing wherein the conversion element is irradiatable with laser radiation of the laser chip. A method of producing such a laser component includes providing component parts of the laser component including a laser chip, a conversion element for radiation conversion and housing parts, and assembling the component parts of the laser component such that a housing is provided within which the laser chip and the conversion element are arranged, wherein the conversion element is irradiatable with laser radiation of the laser chip.


Find Patent Forward Citations

Loading…